图是合金纳米复合电刷镀镀层在脱落部位的镀层。基体交界处的元素分布图，由图可知Fe元素在脱落后的表面分布较多，而在合金纳米复合镀层表面分布较少，Ni元素在合金纳米复合镀层分布较多，在脱落后的基体上基本没有，Co元素在合金纳米复合镀层分布较多，在脱落后的基体上也有较多的分布。电化学沉积层存在化学键结合，化学键结合

强度较高，整体结合强度较高，受力作用时不易解离，而机械嵌合，受力时容易断裂，在脱落部分区域残留合金元素，但合金元素留有量很低，说明合金纳米复合镀层和基体的结合存在化学键结合和机械结合。根据三种元素的分布特征，可以看出中间存在很大的过渡区域，说明断裂部位较宽，在受力时能承受较大的剪切力。

The figure shows the plating of alloy nanocomposite electrobrush plating layer at the exfoliated part. The element distribution at the junction of the substrate, from the figure, it can be seen that Fe element is more distributed on the surface after shedding and less distributed on the surface of the alloy nanocomposite plating layer, Ni element is more distributed on the alloy nanocomposite plating layer and basically not on the substrate after shedding, Co element is more distributed on the alloy nanocomposite plating layer and more distributed on the substrate after shedding. Chemical bonding exists in the electrochemically deposited layer, and the chemical bonding The overall bonding strength is higher, and it is not easy to dissociate when subjected to force, while the mechanical embedding, which is easy to fracture when subjected to force, has residual alloying elements in the exfoliated part area, but the amount of alloying elements retained is very low, indicating the existence of chemical bonding bonding and mechanical bonding in the bonding of alloy nanocomposite plating and substrate. According to the distribution characteristics of the three elements, it can be seen that there is a large transition area in the middle, which indicates that the fracture area is wider and can withstand larger shear force when subjected to force.