| 分析测试报告 |
1150℃热型温度下的连铸坯光学金相 |
Optical metallography of continuous casting billet at 1150℃ hot mold temperature |
高端集成电路关键材料Cu-Ni-Si合金带材短流程低成本生产关键技术开发与应用 |
2023-04-02 |
| 分析测试报告 |
1.5连铸速度下的连铸坯光学金相 |
Optical metallography of continuous casting slab at 1.5 continuous casting speed |
高端集成电路关键材料Cu-Ni-Si合金带材短流程低成本生产关键技术开发与应用 |
2023-04-02 |
| 分析测试报告 |
0.5连铸速度下的连铸坯光学金相 |
Optical metallography of continuous casting slab at 0.5 continuous casting speed |
高端集成电路关键材料Cu-Ni-Si合金带材短流程低成本生产关键技术开发与应用 |
2023-04-02 |
| 分析测试报告 |
800L/h连铸坯光学金相 |
800L/h continuous casting billet optical metallography |
高端集成电路关键材料Cu-Ni-Si合金带材短流程低成本生产关键技术开发与应用 |
2023-04-02 |
| 分析测试报告 |
固溶900℃ 4h连铸态光学金相 |
Optical metallography of continuous casting billet after solid solution at 900℃ for 4h. |
高端集成电路关键材料Cu-Ni-Si合金带材短流程低成本生产关键技术开发与应用 |
2023-04-02 |
| 分析测试报告 |
固溶900℃ 2h连铸态光学金相 |
Optical metallography of continuous casting billet after solid solution at 900℃ for 2h. |
高端集成电路关键材料Cu-Ni-Si合金带材短流程低成本生产关键技术开发与应用 |
2023-04-02 |
| 分析测试报告 |
固溶900℃ 1h连铸态光学金相 |
Optical metallography of continuous casting billet after solid solution at 900℃ for 1h. |
高端集成电路关键材料Cu-Ni-Si合金带材短流程低成本生产关键技术开发与应用 |
2023-04-02 |
| 分析测试报告 |
固溶900℃ 0.5h连铸态光学金相 |
Optical metallography of continuous casting billet after solid solution at 900℃ for 0.5h. |
高端集成电路关键材料Cu-Ni-Si合金带材短流程低成本生产关键技术开发与应用 |
2023-04-02 |
| 分析测试报告 |
固溶900℃ 0.5h连铸态光学金相 |
Optical metallography of continuous casting billet after solid solution at 900℃ for 0.5h. |
高端集成电路关键材料Cu-Ni-Si合金带材短流程低成本生产关键技术开发与应用 |
2023-04-02 |
| 分析测试报告 |
1300℃热型温度下的连铸坯光学金相 |
Optical metallography of continuous casting billet at 1300℃ hot mold temperature |
高端集成电路关键材料Cu-Ni-Si合金带材短流程低成本生产关键技术开发与应用 |
2023-04-02 |
